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Kiss-Cut Dies

Kiss-cutting allows precise kiss-cutting of material layers up to the backing, ideal for removable adhesive parts or labels. Krückemeyer also offers kiss-cut solutions tailored for automated downstream processing.

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Kiss Cut Stanzen individuell

TechniqueMaterial removal, layer by layer
Feature IDifferent shapes of various layers
Feature IICustom inner cutouts
Feature IIIPunching without damaging the backing

Kiss-cutting is feasible in all punching processes. Unlike die-cutting, it is not completely cut through – for example the backing or individual layers in a laminate remain intact.

TechniqueContinuous punching using a punch-cylinder tool
Working widthup to 250 mm
Thicknessup to 2 mm
Tolerances±0.5 mm

In rotary punching, kiss-cutting is a standard procedure — precisely because the punched parts sit on a siliconized carrier film, which of course is not cut through.

Technique<\/strong><\/td>Registration- or pinpoint stamping with camera technology<\/td><\/tr>
Working width<\/strong><\/td>up to 600 mm<\/td><\/tr>
Tolerances<\/strong><\/td>
TechniqueStamping using a band-steel cutting tool
Working widthup to 600 mm
Thicknessup to 10 mm
Tolerances±0.5 mm

Also for punching and flat-bed stamping, Kiss-cut is standard practice in stamping and can be flexibly implemented in custom formats.

Technical films<\/td>Electronics | Thermal | etc.<\/td><\/tr>
Protective films<\/strong><\/td>Surface protection | Product protection<\/td><\/tr>
Adhesive tapes<\/strong><\/td>Single- & double-sided<\/td><\/tr>
Foams<\/strong><\/td>PE | PU | EPDM<\/td><\/tr>
Custom materials<\/strong><\/td>All cut- & rollable materials<\/td><\/tr>
Non-adhesive<\/strong><\/td>
Adhesive dotsCustom diameters
Adhesive tapesCustom dimensions
Custom adhesive die-cut partsAll 2D shapes
Adhesive pads & sheetsCustom dimensions
Carrier mediaRolls & sheets | individual parts

In the end, we can supply the die-cut materials in custom configurations—exactly tailored to your application and your process.

Häufige Fragen zum Kiss Cut Stanzen

During Punching of double-sided adhesive foils, the two-sided adhesive film materials on both sides are contour-cut into precisely defined shapes—matched exactly to the component geometry and the assembly process.

This solution is particularly advantageous when:

  • two substrates are to be permanently joined
  • precise fits in the serial production process are required
  • thin, nearly invisible adhesive bonds are desired
  • assembly times should be reduced and processes automated

Punched adhesive foils enable a clean, reproducible, and assembly-ready solution.

Almost all market-standard double-sided systems can be processed, e.g.,:

  • Double-sided transfer adhesive films (without carrier)
  • Carrier-based adhesive films (e.g., PET carrier)
  • Thin high-performance films for permanent bonding
  • Foam-based double-sided systems
  • Custom-laminated multilayer composites

Additionally, adjustments such as adhesive formulation changes, one- or two-sided modifications, or the replacement of the protective cover (paper or film liner) are possible.

The achievable precision depends on the material structure and the overall thickness.

Through modern punching technology as well as optical quality control, tight dimensional tolerances and high repeatability are possible – even for intricate contours, internal cutouts, or functional openings.

Depending on the application process, a range of finishing options is available:

  • Loose individual parts
  • On rolls (for automatic feeding)
  • On sheets
  • With finger lift or peel-off aid
  • With defined non-adhesive areas
  • With modified protective cover
  • As an installation-ready, multi-layer composite solution

The configuration is tailored precisely to the intended assembly process – manual, semi-automatic, or fully automatic.

Cost efficiency is determined, among other factors, by:

  • Film type and total thickness
  • Type of adhesive (e.g., for low-energy substrates)
  • Contour complexity
  • Tooling effort
  • Quantity
  • Additional processes such as laminating, liner changes, or application aids

Modular manufacturing processes enable both prototypes and production runs to be produced cost-effectively.

To enable accurate costing, the following information is helpful:

  • Technical drawing or die-cut contour
  • Material specification or substrate details
  • Overall thickness and the desired adhesive type
  • Requirements for temperature, UV, or chemical resistance
  • Desired delivery form
  • Project or annual quantity
  • Information about the application process

The more precise the information, the more efficiently the optimal adhesive solution can be developed.

Samples and pre-series can be produced on short notice.

Thanks to flexible stamping and converting processes, rapid test samples are possible – ideal for validations, pilot runs, or process optimizations.

Kiss-Cut kann mit verschiedenen Stanzverfahren umgesetzt werden, zum Beispiel Rotationsstanzen, Servo-Rotationsstanzen sowie Hub- und Flachbettstanzen. Die Seite nennt Kiss-Cut als umsetzbar in allen Stanzverfahren und beschreibt Rotationsstanzen, Servo-Rotationsstanzen sowie Hub- und Flachbettstanzen als geeignete Verfahren.

Hilfreich sind eine Zeichnung, Materialaufbau, gewünschte Stanzkontur, zu trennende Lage, Trägermaterial, Materialdicke, Lieferform, Stückzahl und Verarbeitungsprozess. Zusätzlich sollte angegeben werden, ob entgittert werden soll und ob die Teile manuell, halbautomatisch oder automatisiert entnommen werden.

Kiss-Cut ist weniger geeignet, wenn alle Lagen vollständig getrennt werden sollen oder kein Trägermaterial erhalten bleiben darf. In solchen Fällen kann ein Vollschnitt beziehungsweise Die-Cut besser passen. Auch sehr schwierige Materialaufbauten, ungleichmäßige Dicken oder empfindliche Träger können eine Machbarkeitsprüfung erforderlich machen.

Ihr Ansprechpartner

Thomas Klein

  • Expert in customized adhesive solutions
  • Project business 'adhesive technology'
  • For over 20 years in the industry

CALL 02739 / 801-900

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